Hybrid processes may include:
- Silk screening metallic inks and dielectric (non-conductive) materials to produce circuits, transistors, resistors, diodes, indicators, transformers, capacitors, etc.
- Firing.
- Passive trimming resistors to desired value.
- Placing the surface-mount components and subsequently reflowing the solder.
- Cleaning.
- Packaging the new device as needed.
- Dispensing the adhesive and placing the bare semiconductor die.
- Curing the adhesive.
- Wire bonding the die to make electrical connection between the die and the circuits.
- Encapsulating the die to protect it and the wires.
- Active trimming resistors to specified voltage of circuit.
- Testing the circuit.