Hybrid Thick-Film Assembly

Thick-film hybrid circuit

This is a type of electronic circuit in which conductive tracks and passive components like resistors are printed directly onto a ceramic substrate using a thick-film technology, often through a screen-printing process. This method allows for high reliability and operation in harsh environments, making it suitable for applications like aerospace, defense, and medical devices.

Advantages of hybrid circuits

  • High reliability: Can withstand extreme temperatures, vibrations, and other harsh condition.
  • Customizable design allows for flexible circuit layouts and component integration.
  • Good electrical performance, especially in high-frequency applications.
  • Can fit a niche bracketed by an application-specific integrated circuit (ASIC) on one side and a conventional circuit board on the other.
  • Can include components that cannot be included in an IC.
  • Can be substantially smaller than a conventional assembly.

Applications

  • Aerospace Electronics.
  • Military Equipment.
  • Medical Devices.
  • High-Power Applications.
  • Instrumentation.

Learn more about our Hybrid Thick-Film services