Higher-Level Assembly Integration & Testing
- Multilevel system integration.
- Electronic / electromechanical.
- Multilevel Assembly & Test.
- Backplane Assembly & Test.
- Electromechanical Assembly & Test.
- Higher-Level Assembly & Test.
- Variety of enclosures (sheet metal / cast / plastic).
- Precision mechanical.
- Complex box assemblies.
- Building & testing of Circuit Card Assembly (CCA) modules, integrating into the next-higher-level assembly.
- System-level testing, including functional testing & environmental testing (Highly Accelerated Stress, Screening, Vibration Testing, and Environmental Stress Screening).
- Robust torque, Electrostatic Discharge(ESD) and Foreign Object Debris (FOD) control.
- Custom cell design for manufacturing.
- Flying probe test.
- Functional test.
- Boundary scan.
- X-ray.
- Automated Optical Inspection (AOI) (inline & bench-top).
Our other Higher-Level Assembly services
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