CCA Capabilities
- 4 fine-pitch surface mount lines (Europlacer equipment).
- Automated and semi-automated plated through-hole and mixed technology.
- Smallest BGA pitch 0.3mm.
- Package sizes down to 01005 form factor.
- Large form factor PCBAs.
- Column grid arrays and ceramic standoffs.
- High-density PCBAs.
- 264 8mm feeder lanes per SMT equipment.
- 2-D & 3-D paste inspection measurement technology.
- 4 inline stencil printers.
- Inline automated 3-D solder paste inspection.
- Max panel size 450mm X 500mm.
- Flex and rigid-flex manufacturing on various finishes, such as HASL, ENIG and ENEPIG.
- RF, analog, high-speed, and digital circuits on rigid-flex and copper core substrates.
- Typical lot sizes of 1-500 pieces.
- Reflow profiling.
- Large field of view (LFOV) x-ray inspection.
- Aqueous cleaning with deionized (DI) water.
- Ionograph testing.
- Schematic capture and printed circuit board (PCB) layout support.
- Flexible wave solder systems with selective solder capabilities.
- Conformal coating capabilities for silicone, acrylic, urethane, and parylene.