Hybrid thick-film assemblies
UEC Advanced Circuit Technologies (ACT) has decades of experience providing high-quality, reliable electronics with precision manufacturing, quick turnaround times, and the flexibility to handle any CCA, from simple designs to complex, high-part-count, multilayer circuit cards through higher-level assembly, and hybrid thick-film assemblies.
A thick-film hybrid circuit is a type of electronic circuit in which conductive tracks and passive components like resistors are printed directly onto a ceramic substrate using a thick-film technology, often through a screen-printing process. This method allows for high reliability and operation in harsh environments, making it suitable for applications like aerospace, defense, and medical devices.